Failure Analysis Engineering Aide

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  • As an Equal Employment Opportunity Employer, DAVIS has reporting requirements which require us to invite employees to voluntarily self-identify their race/ethnicity. Submission of this information is voluntary and refusal to provided it will not subject you to any adverse treatment. The information obtained will be kept confidential.
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Failure Analysis Engineering Aide

  • Specialty:

    Engineering
  • Title:

    Failure Analysis Engineering Aide
    • City:

      Lincoln
    • State:

      RI
    • Zip Code:

      02865
  • Start date:

    12-06-2018
  • Status:

    Closed
  • Assignment Type:

    Direct Hire
  • Job Id:

    47366

Description

Davis Engineering is partnering with a great company in Lincoln, Rhode Island to hire an experienced Failure Analysis Specialist to partner with their engineering team, on a direct basis. Candidate must have strong electronics background including IC and PCB physical failure analysis experience. If interested in this position, please apply with your Word formatted resume including contact information. To expedite the process, you can send your resume to Rich Gardner at rgardner@daviscos.com or Samantha Hampton at shampton@daviscos.com to be considered faster.

Failure Analysis Engineering Aide

Responsibilities:

  • Provides timely and accurate root-cause analysis of products (IC’s, System-in-Package, and filters) using electrical and physical failure analysis techniques
  • Supports Failure Analysis Engineers and works with cross-functional teams (Manufacturing, Quality, Reliability, Design, etc.) to solve problems arising from customer returns, process anomalies, engineering evaluations, and new product development.
  • Communicates analysis results through formal, technical report writing
  • Collaborates with internal and external laboratories as needed
  • Meets failure analysis cycle-time requirements

Critical knowledge and abilities:

  • Strong knowledge and experience utilizing physical failure analysis techniques for IC’s and PCB’s including cross-sectioning, parallel lapping, Reactive Ion Etching, decapsulating, X-ray analysis and chemical deprocessing
  • Experience utilizing optical and scanning electron microscopes including EDX (Energy Dispersive X-ray) analysis
  • Ability to troubleshoot electrical failures by micro-probing and using electrical test equipment
  • Adept at I/V curve-tracing using analog and multi-pin, digital curve tracers (RTI).
  • Experience building evaluation boards by interpreting schematics and soldering components
  • Demonstrated proficiency utilizing MS Word, Excel, photo-editing, schematic and IC layout software
  • Familiar with FA techniques in order to effectively direct external lab’s: EMMI, FIB, CSAM, OBIRCH, TIVA, LIVA, etc.
  • Able to write concisely using good spelling, grammar, and proofreading skills
  • Must be highly organized with a strong attention to detail. Must be able to manage multiple, concurrent assignments under tight deadlines
  • Able to follow instructions, maintain priorities, and make good decisions with minimal supervision
  • Has an FA mindset understanding FA processes, flow, and decision tree
  • Familiar with IC packaging, semiconductor processes, and PCB manufacturing
  • Experience working within an ISO-9001 work environment is a plus

Qualifications:

  • 5+ years of relevant Failure Analysis experience in the semiconductor or PCB industry
  • Associate degree or technical certification in Electronics
  • Excellent interpersonal and communications skills

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