Failure Analysis Engineering Tech

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Failure Analysis Engineering Tech

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    Failure Analysis Engineering Tech
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Failure Analysis Engineering Tech


  • Provides timely and accurate root-cause analysis of VPC products (IC’s, System-in-Package, and filters) using electrical and physical failure analysis techniques.
  • Supports Failure Analysis Engineers and works with cross-functional teams (Manufacturing, Quality, Reliability, Design, etc.) to solve problems arising from customer returns, process anomalies, engineering evaluations, and new product development.
  • Communicates analysis results through formal, technical report writing.
  • Collaborates with internal and external laboratories as needed.
  • Meets failure analysis cycle-time requirements

Minimum Requirements

  • 5+ years of relevant Failure Analysis experience in the semiconductor or PCB industry
  •  Associate degree or technical certification in Electronics
  • Excellent interpersonal and communications skills
  • Strong knowledge and experience utilizing physical failure analysis techniques for IC’s and PCB’s including cross-sectioning, parallel lapping, Reactive Ion Etching, decapsulating, X-ray analysis and chemical deprocessing.
  • Experience utilizing optical and scanning electron microscopes including EDX (Energy Dispersive X-ray) analysis
  • Ability to troubleshoot electrical failures by micro-probing and using electrical test equipment
  • Adept at I/V curve-tracing using analog and multi-pin, digital curve tracers (RTI).
  • Experience building evaluation boards by interpreting schematics and soldering components
  • Demonstrated proficiency utilizing MS Word, Excel, photo-editing, schematic and IC layout software
  •  Familiar with FA techniques in order to effectively direct external lab’s: EMMI, FIB, CSAM, OBIRCH, TIVA, LIVA, etc.
  •  Able to write concisely using good spelling, grammar, and proofreading skills
  •  Must be highly organized with a strong attention to detail. Must be able to manage multiple, concurrent assignments under tight deadlines
  •  Able to follow instructions, maintain priorities, and make good decisions with minimal supervision
  •  Has an FA mindset understanding FA processes, flow, and decision tree
  •  Familiar with IC packaging, semiconductor processes, and PCB manufacturing
  •  Experience working within an ISO-9001 work environment is a plus

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